(module TE_5767171-1_2x19_P0.635mm_Vertical (layer F.Cu) (tedit 5E74B9D8)
  (descr "PCB Mount Receptacle, Vertical, Board-to-Board, 38 Position, 24.003mm / .64mm [.945in] Centerline, Header Only, Palladium Nickel (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F5767171%7FB2%7Fpdf%7FEnglish%7FENG_CD_5767171_B2.pdf%7F5767171-1#page=2)")
  (tags "mictor38 receptacle board-to-board")
  (attr smd)
  (fp_text reference REF** (at 0 -14.1575) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value TE_5767171-1_2x19_P0.635mm_Vertical (at 0 14.5425) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -3.65 -12.8575) (end 3.65 -12.8575) (layer F.SilkS) (width 0.12))
  (fp_line (start 3.65 12.8425) (end -3.65 12.8425) (layer F.SilkS) (width 0.12))
  (fp_line (start -3.65 12.8425) (end -3.65 6.2925) (layer F.SilkS) (width 0.12))
  (fp_line (start 3.65 6.2925) (end 3.65 12.8425) (layer F.SilkS) (width 0.12))
  (fp_line (start -3.65 -6.3575) (end -3.65 -12.8575) (layer F.SilkS) (width 0.12))
  (fp_line (start 3.65 -12.8575) (end 3.65 -6.3075) (layer F.SilkS) (width 0.12))
  (fp_line (start -3.65 -6.3575) (end -4.4 -6.3575) (layer F.SilkS) (width 0.12))
  (fp_text user %R (at 0 -3.3575) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -4.66 -13.2) (end 4.66 -13.2) (layer F.CrtYd) (width 0.05))
  (fp_line (start 4.66 -13.2) (end 4.66 13.2) (layer F.CrtYd) (width 0.05))
  (fp_line (start 4.66 13.2) (end -4.66 13.2) (layer F.CrtYd) (width 0.05))
  (fp_line (start -4.66 13.2) (end -4.66 -13.2) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.5 12.7) (end -3.5 -12.7) (layer F.Fab) (width 0.1))
  (fp_line (start -3.5 -12.7) (end 3.5 -12.7) (layer F.Fab) (width 0.1))
  (fp_line (start 3.5 -12.7) (end 3.5 12.7) (layer F.Fab) (width 0.1))
  (fp_line (start -3.5 12.7) (end 3.5 12.7) (layer F.Fab) (width 0.1))
  (pad "" np_thru_hole circle (at 0 -11.44 90) (size 2.39 2.39) (drill 2.39) (layers *.Cu *.Mask))
  (pad 1 smd rect (at -3.53 -5.725 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -3.53 -5.09 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -3.53 -4.455 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -3.53 -3.82 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at -3.53 -3.185 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at -3.53 -2.55 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at -3.53 -1.915 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at -3.53 -1.28 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at -3.53 -0.645 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd rect (at -3.53 -0.01 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 21 smd rect (at -3.53 0.625 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 23 smd rect (at -3.53 1.26 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 25 smd rect (at -3.53 1.895 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 27 smd rect (at -3.53 2.53 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 29 smd rect (at -3.53 3.165 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 31 smd rect (at -3.53 3.8 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 33 smd rect (at -3.53 4.435 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 35 smd rect (at -3.53 5.07 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 37 smd rect (at -3.53 5.705 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at 3.53 -5.725 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at 3.53 -5.09 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 3.53 -4.455 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 3.53 -3.82 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 3.53 -3.185 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 3.53 -2.55 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 3.53 -1.915 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at 3.53 -1.28 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 3.53 -0.645 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd rect (at 3.53 -0.01 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 22 smd rect (at 3.53 0.625 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 24 smd rect (at 3.53 1.26 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 26 smd rect (at 3.53 1.895 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 28 smd rect (at 3.53 2.53 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 30 smd rect (at 3.53 3.165 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 32 smd rect (at 3.53 3.8 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 34 smd rect (at 3.53 4.435 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 36 smd rect (at 3.53 5.07 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad 38 smd rect (at 3.53 5.705 180) (size 1.27 0.43) (layers F.Cu F.Paste F.Mask))
  (pad SH thru_hole circle (at 0 -5.09 90) (size 1.318 1.318) (drill 0.81) (layers *.Cu *.Mask))
  (pad SH thru_hole circle (at 0 -2.55 90) (size 1.318 1.318) (drill 0.81) (layers *.Cu *.Mask))
  (pad SH thru_hole circle (at 0 -0.01 90) (size 1.318 1.318) (drill 0.81) (layers *.Cu *.Mask))
  (pad SH thru_hole circle (at 0 2.53 90) (size 1.318 1.318) (drill 0.81) (layers *.Cu *.Mask))
  (pad SH thru_hole circle (at 0 5.07 90) (size 1.318 1.318) (drill 0.81) (layers *.Cu *.Mask))
  (model ${KISYS3DMOD}/Connector_TE-Connectivity.3dshapes/TE_5767171-1_2x19_P0.635mm_Vertical.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)