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V5.4.3.6
776f77d
2024-05-31 14:22
对比
Release V5.4.3.6
ying.jing
## V5.4.3.6 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V5.4.3.2_Patch_0001
bd1bfd9
2024-05-30 17:10
对比
Release V5.4.3.2_Patch_0001
ying.jing
## V5.4.3.2_Patch_0001 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM: ## V1.7.0.0 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V5.3.1
2461261
2024-05-30 16:58
对比
Release V5.3.1
ying.jing
## V5.3.1 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RA
最后提交信息为：
Update ci_test_Release_Note.md
V4.0.0.7
aa5c615
2024-05-30 11:55
对比
Release V4.0.0.7
ying.jing
## V4.0.0.7 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V4.0.0.6_Patch_0001
06a4c96
2024-05-30 11:51
对比
Release V4.0.0.6_Patch_0001
ying.jing
## V4.0.0.6_Patch_0001 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V2.1.3
b7b34dc
2024-05-30 11:48
对比
Release V2.1.3
ying.jing
## V2.1.3 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V3.1.1.3
3f0146d
2024-05-30 10:37
对比
Release V3.1.1.3
ying.jing
## V3.1.1.3 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V3.1.1.2
dab97e3
2024-05-30 09:45
对比
Release V3.1.1.2
ying.jing
## V3.1.1.2 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V4.0.0.4_Patch_0001
1a899ba
2024-05-30 09:42
对比
Release V4.0.0.4_Patch_0001
ying.jing
## V4.0.0.4_Patch_0001 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V4.0.0.3
5e13a28
2024-05-30 09:38
对比
Release V4.0.0.3
ying.jing
## V4.0.0.3 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V1.7.0.0
3f0146d
2024-05-29 16:57
对比
Release V1.7.0.0
ying.jing
## V1.7.0.0 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V4.0.0.0_0
b341479
2024-05-28 17:51
对比
Release V4.0.0.0_0
ying.jing
## V4.0.0.0_0 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V4.0.0.0_Patch_0001
4a81459
2024-05-28 17:44
对比
Release V4.0.0.0_Patch_0001
ying.jing
## V4.0.0.0_Patch_0001(FR) ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V3.1.1.1_Ptach_0001
04ca6ae
2024-05-27 17:50
对比
Release V3.1.1.1_Ptach_0001
ying.jing
## V3.1.1.1_Ptach_0001 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V3.0.0_Patch_0001
cd6a398
2024-05-27 17:46
对比
Release V3.0.0_Patch_0001
ying.jing
## V3.0.0_Patch_0001 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V1.7.0_Patch_0001
6c4f8d6
2024-05-27 17:33
对比
Release V1.7.0_Patch_0001
ying.jing
## V1.7.0 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ABC
V1.6.0
fe75bfe
2024-05-27 17:20
对比
Release V1.6.0
ying.jing
## V1.6.0 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V2.1.1
29bbda5
2024-05-27 17:15
对比
Release V2.1.1
ying.jing
## V2.1.1 ### Version * SDK version: telink_b85m_platform_sdk V1.9.0. * This version of SDK supports B80(A1), B80B, B85, B87 chips. * The default configuration of LEDs and KEYs match the following hardware revisions: * B80 C1T261A30_V1_1 * B80B C1T321A30_V1_0 * B85 C1T139A30_V1_2 * B87 C1T197A30_V1_2 ### Features * item1 * item2 ### Bug Fixes * module - item1 - item2 ### BREAKING CHANGES * The items can cause the SDK upgrade issues, the solution to the upgrade issues need to be added. ### CodeSize * Flash： * OTP: * RAM: ### Features * 改动1 * 改动2 ### Bug Fixes * 改动1 * 模块 - 改动1 - 改动2 ### BREAKING CHANGES * The modifications that could cause SDK upgrade issues should include a solution for addressing the upgrade problems. ### CodeSize * Flash： * OTP: * RAM:
最后提交信息为：
Update ci_test_Release_Note.md
V1.4.0
1be6f12
2024-05-27 14:55
对比
Release V1.4.0
ying.jing
V1.4.0
最后提交信息为：
Update README.md, doc/ci_test_Release_Note.md files
V1.3.0
980b001
2024-05-27 14:47
对比
Release V1.3.0
ying.jing
V1.3.0
最后提交信息为：
Update README.md, doc/ci_test_Release_Note.md files
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